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Thin Film Deposition

We are a leading Retail Trader of ion beam etching system, rapid thermal processing system, reactive ion etching systems, plasma assisted mocvd systems, ald system and sputtering systems from Delhi, India.

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Product Details:
SS Cube Ion Beam Chamber14.5 Inch
DC Ion Gun12 cm
Motor Driven1000V, 500 mA
Typical Etch Rates200 A/min Cu, 500 A/min
Base Pressure8x10-8 Torr with 1000 l/sec Turbo Pump
Chilled Water Cooled Substrate Platen6 Inch

Etching of metals such as Cu, Au. It has demonstrated capability of keeping substrate temperature below 50 °C along with wafer rotation to achieve the desired uniformity which makes it possible to etch wafers with resist pattern.


Features:
  • Ion Beam neutralizer
  • Ar MFC
  • Wafer rotation
  • Wafer Tilt
  • Manual or Auto wafer load/unload
  • Magnetron Sputtering of Si3N4 to protect etched metal surfaces from oxidation
  • PC Controlled with Lab view Software
  • Recipe Driven, Password Protected
  • Fully Safety Interlocked

Applications:
  • Surface Cleaning
  • Surface Treatment
  • Ion Beam Milling
  • Ion Beam Etching with

Reactive Gases:
  • Grating
  • Deep Trenches on SiO2, Si and Metals
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Product Details:
Resolution80x60
VisualizationFull Colored
Ramping Up Rate1200 dC/ 15 sec 80dC/sec
PressureMax 10 exp-3 torr
Ambient AirMax 300
Vacuum StatusMax 1200 (10 e-3 torr)
Power SourceElectric
Rapid Thermal Processing System is able to do heat treatment on a maximum 4-inch wafer in very high speed. And, we have installed 12 pcs of halogen lamps and it can make it possible to do heat treatment on the sample uniformly. Furthermore, it is very convenient to use and we are providing at the reasonable price. Therefore, it is good to use in university and laboratory.

Features:
  • Compact desktop design, convenient to control.
  • Minimize pollution of the chamber inside.
  • Transparent quartz chamber.
  • Gas input (Purge gas).
  • Keep chamber cooling by flowing cooling water.
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Product Details:
Chamber MaterialAluminium or Stainless
CabinetStainless Steel
Anodized RF PlatenUpto 12 Inch
Base PressureApproximately 10-6 Torr Less Than 20 minutes, ~ 5 x10-7 Torr
Dual Etch CapabilityRIE and Plasma Etch
Stand alone Reactive Ion Etching (RIE) system with shower-head gas distribution and water cooled RF platen. It has a stainless steel cabinet and a 13” cylindrical Aluminum chamber that opens from top for wafer loading. Chamber has two ports, one with a 2” window the other with a blank off for end point detection and for other diagnostic. It can accept up to 12” (300 mm) wafers. The RF power is provided by 600 W 13.5 MHz power supply, and auto-tuner. The self DC bias is continuously monitored and reaches as high as -500 V which is important for anisotropic etching.

Features:
  • Capable of etching Si compounds (~400 Å /min)and metals
  • Typical Si etch rate, 400 Å/min
  • Water Cooled and Heated RF Platen
  • Shower Head gas distribution
  • Up to four MFC’s on NRE-3000 and up to eight MFCs on NRE-4000
  • Down Stream Pressure Control
  • End Point Detection
  • Pneumatically Lifted Top
  • Manual or automatic loading/unloading,
  • Load Lock
  • PC Controlled with Lab view
  • Recipe Driven, Password Protected
  • Fully Safety Interlocked
  • Optional ICP source and cryogenic cooling of the platen for deep Si etch
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Product Details:
Cube ChamberStainless Steel
Platen Temparature1100 Degree Celsius
Power SourceElectric
Body MaterialStainless Steel
ApplicationIndustrial

The first Table Top Plasma Assisted Metal Organic Chemical Vapor Deposition (PA-MOCVD) system for InGaN and AlGaN deposition processes. The features include five bubblers with individual cooling baths, heated gas lines, 950 °C platen, three gas rings, RF plasma source with Shower Head Gas Distribution and N2 flush at the end of the process, 5 10-7 Torr base pressure, 250 l/sec turbo pump with oil-free scroll pump, PC controlled, fully automated and safety interlocked.

 

Recently this technology has been extended to five 4” wafer stand alone batch system which can be integrated into a cluster configuration to meet high throughput production needs.

Features:
  • Stand Alone System
  • 6” ,8” Platen or five 4” Wafers on 12” platen
  • Heated Gas Lines
  • RF Plasma Source with Auto Tuner
  • Shower Head Gas Distribution
  • N2 Flush
  • Manual or Automatic wafer Loading and Unloading
  • 250 l/sec Turbomolecular Pump with Oil Free Scroll Pump
  • Compatible with Cluster Configuration

Applications:
  • Green LED’s (GaN, InGaN, AlGaN,)
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Product Details:
Automatic GradeAutomatic
Power SourceElectric
Frequency50/60 Hz
Voltage220 V

Keeping in mind the variegated demands of customers, we are engaged in providing ALD System.

 

Features:

  • High performance

  • Low maintenance

  • Longer service life

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Product Details:
Voltage208-240 V AC
Frequency50/60 Hz
Power5 kW
Power SourceElectric
Sputtering Systems. come with water cooled rotating 8” platen and up to three off-axis planar magnetrons. The system is pumped with a turbo molecular pump and achieves low 10-6 Torr within 15 minutes. RF or DC power is applied to the individual magnetron through an RF switch. Magnetron to substrate distance is adjustable in order to achieve desired uniformity and deposition rate. Rotating platen with off axis magnetrons provide means of achieving the best film uniformity. Crystal thickness monitor is provided for terminating process automatically.

Features:

  • Manual and semi-PC Controlled
  • Compact Stand Alone System
  • Table Top
  • Dual Systems
  • Sputtering and RIE System
  • Sputtering and PECVD System
  • Sputtering and Thermal Evaporator System

Applications:
  • Metal and dielectric coating of wafers, ceramics, glass blanks and disk heads
  • Optical and ITO coatings
  • Hard coatings with high temperature platens and Pulsed DC power supplies
  • Reactive sputtering with RF plasma discharge
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Product Details:
Power SourceElectric
Base Pressure5 10-7 Torr
Footprint Size46D x 44W Inch
Body MaterialStainless Steel
Optical Coating Systems provides state of the art atomic cleaning and polishing of optical samples in one chamber and transferring sample to second chamber for optical coating of the same samples without breaking vacuum. The system is also designed to be able to use each chamber independent of the other with their own automatic sample loading and unloading.

Features

  • RF Biasable Platen
  • Thickness Monitor
  • High Accuracy and Repeatability
  • High Quality Films
  • Atomic Level Clean Surfaces
  • Atomic Cleaning and Polishing
  • PC Controlled with Lab view
  • Automatic Load/Unload
  • Automatic Transfer Between Chambers
  • Recipe Driven, Password Protected
  • Safety Interlocks
  • Options
  • Sputter Down/Up
  • Co-Sputtering
  • DC, RF and Pulsed Power Supplies
  • Ion Beam Assisted Deposition
  • E-Beam Sources
  • Plasma Sources


Applications:

  • Optical Coatings
  • Sputtering
  • IBAD
  • Ion Beam Etching Cleaning
  • Ion Beam Assisted Reactive Etching
  • Infrared Coatings
  • Surface Treatment

 

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Product Details:
PlatesUp to 7x7 Inch
Wafers200 mm
SRC Controlled Power Supply2KVA
Power SourceElectric

PC controlled table top Thermal Evaporator System with wide ranges of applications in organic to metal evaporation. It is designed with extreme care to achieve clean, uniform, controllable and reproducible process on a small footprint.


Features:

  • Deposition Rate Controlled
  • Rotating Sample Holder
  • Dual Crucible
  • Crystal Thickness Monitor
  • PC Controlled with Lab view

 

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Product Details:
Switching Power Supply10 KW
Turbomolecular Pump10-7 Torr
Power SourceElectric
ApplicationIndustrial
Electron Beam Evaporation Systems come in a dual chamber configuration consisting of the main chamber where platen is located and a secondary chamber for housing the e-beam source. Co-evaporation capability with multiple e-beam sources and ability to program compositions or compositional gradients through PC control can be provided.

Features:

  • Sequential or Co-Evaporation
  • Dual E-Beam Source
  • Multi-Pocket E-Gun
  • Programmable Beam Scan
  • Manual Load/Unload w/Load Lock
  • Auto Load/Unload
  • Easy Material and Liner Change
  • Crystal Thickness Monitor
  • PC Controlled with Lab view
  • Recipe Driven, Password Protected
  • Fully Safety Interlocked
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Dynotech Instruments Private Limited

Koshy Mathew(Manager Sales)
803-804, Vishwa Sadan, District Center
Janakpuri, Delhi - 110058
India
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