Dynotech Instruments Private Limited
Janakpuri, Delhi
GST No. 07AABCD4420H1Z2
TrustSEAL Verified
Call 0804842558767% Response Rate
SEND EMAIL
???Low solid content (45-50%)
???High adhesion (> 3N/mm)
???High soldering ability
???Well printability
???High compatibility with Aluminum paste
???Lead free
Solid content - 48±2%
Screen printing - 165-250 mesh SS screen
Firing - Peak temperature, 750-950???
Adhesion strength - >3N/mm
Adhesion strength after aged (150???for 30min) -
Compact machine designed for demanding fab utilization in solar cell industry,
where throughput per m2 result in best ratio. With parallel wafer processing under dual scanner,
the throughput is able to reach over 3600 wph,
lead to best investment cost $/Watt.
| Substrate size | 156 x 156 mm, other size upon request |
| Laser sources |
Wave length: 1064, 1030, 532, 515, 355 nm Pulse: µs, ns, ps, fs |
| Pattern | Line, Dash, Dot, easy CAD file import/edit |
| Options |
In-line laser power monitor In-line pattern control Automatic empty carrier transfer RFID reader MES interface |
• Single lane loading/unloading
• Wafer buffer magazines for loading and unloading
• Optical breakage control
• Rotary table
• Optical alignment center/edge
• Dual independent laser source
• Parallel wafer processing
???High efficiency and low contact resistance
???Excellent printability and high aspect ratio
???High adhesion strength
???Wide IR window
Solid content - 91±1%
Screen printing - 360 mesh SS screen
Firing - Peak temperature, 750-950???
Adhesion strength - >2N/mm