Compact machine designed for demanding fab utilization in solar cell industry,
where throughput per m2 result in best ratio. With parallel wafer processing under dual scanner,
the throughput is able to reach over 3600 wph,
lead to best investment cost $/Watt.
Substrate size |
156 x 156 mm, other size upon request |
Laser sources |
Wave length: 1064, 1030, 532, 515, 355 nm
Pulse: µs, ns, ps, fs
|
Pattern |
Line, Dash, Dot, easy CAD file import/edit |
Options |
In-line laser power monitor
In-line pattern control
Automatic empty carrier transfer
RFID reader
MES interface
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FEATURES :-
• Single lane loading/unloading
• Wafer buffer magazines for loading and unloading
• Optical breakage control
• Rotary table
• Optical alignment center/edge
• Dual independent laser source
• Parallel wafer processing